SCOTTSDALE, Arizona, March 10 /PRNewswire/ --
- Paper on Thermal Reliability Performance of Large Area WLCSP Arrays to be Presented as Part of WLCSP Track
California Micro Devices (Nasdaq: CAMD) today announced it would deliver a technical paper on the thermal reliability performance of large area WLCSP (wafer level chip scale package) arrays at the IMAPS 5th Annual International Conference and Exhibition on Device Packaging, March 10 through 12, 2009, at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona. The presentation will be part of a technical track of papers sponsored by the WLCSP Forum on wafer level chip scale package board reliability.
WLCSP Thermal Reliability Analyzed