BARCELONA, Mobile World Congress, February 16 /PRNewswire/ --
- 65nm Single Die Integrated Baseband and RF is an Industry First
- Mobile World Congress, Booth 2-1.C28
Sequans Communications, the world's leading WiMAX chipmaker, has introduced its newest chip, the SQN1210, which for the first time integrates baseband and triple band RF in a single 65 nm die, leading to unprecedented achievements in size, cost, and performance.