HSINCHU, Taiwan, R.O.C., July 21 --

- Industry-Wide Collaborative Development Effort Delivers First Unified iPDK
for 65nm Process

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today
announced the release of the semiconductor industry’s first interoperable
process design kit (iPDK) for advanced technology. The kit is fully validated on
TSMC’s 65 nanometer (nm) process and represents the newest design
initiative to come from the company’s Open Innovation Platform(TM),
focusing on enhancing innovation in custom, analog, mixed-signal and RF designs.

TSMC unified iPDK works across multiple OpenAccess(TM)-based EDA design
environments, eliminating the need for multiple proprietary PDKs, and enabling
full reuse of design data between different custom IC design toolsets. The iPDK
initiative is supported by all major EDA vendors including Cadence, Magma,
Mentor, Springsoft, Synopsys, and others. The first iPDK in 65nm was developed
in collaboration with TSMC development partners, Synopsys and Ciranova, and
QA/validation partners, Magma and Springsoft. Its interoperable approach
improves design accuracy, shortens design cycle times, promotes design reuse,
and improves return on design investment.

The iPDK is a long-awaited solution to many of the design problems that have
delayed new technology and tool adoption. Multiple and/or incompatible PDKs on
proprietary custom design databases have limited design reuse and portability,
and has resulted in high development, maintenance and support costs for all
ecosystem partners including TSMC, explains ST Juang, senior director of design
infrastructure marketing at TSMC. The interoperable design kit will enable
higher level of innovation and differentiation for our customers in full custom,
analog, and mixed-signal designs.

TSMC iPDK is based on the OpenAccess database and data model. It features open
standard languages, Tcl and Python, for parameterized layout cells, callbacks,
and technology files and includes unified views of symbols. The modern and
flexible architecture easily accommodates specific customizations, future
feature extensions and advanced and differentiated development. Customers will
be able to extend the iPDK in the languages supported by the custom design tools
of their choice. The iPDK also includes SKILL(TM) callbacks and component
description format (CDF) files to provide compatibility with current
OpenAccess-based PDKs and Cadence IC6.1 environment. TSMC continues to
collaborate closely with key EDA partners to ensure full interoperability
between the new TSMC iPDK and the currently available PDKs.

The new TSMC iPDK’s single interoperable data model and highly productive
development infrastructure enables new iPDKs to be developed quickly and with
consistent quality, and be available earlier for advanced process technology
nodes. TSMC iPDK’s interoperability with multiple EDA tools and design
flows remove design tool and flow adoption barrier, and offer customers more
choices of design tools. The result is faster adoption of tools and flow that
accelerate time-to-design-start for custom analog, mixed signal and RF designs.

TSMC iPDK unified data model on industry-standard OpenAccess database enables
design reuse that is not possible with multiple proprietary PDKs and design
databases. It eliminates duplicate PDK development efforts, significantly
reduces PDK development, validation and support costs across the design
ecosystem, and promotes innovation in analog and full custom design.

Pricing and Availability

The TSMC 65nm iPDK will be available July 2009 in limited release and at no
charge to selected customers. General release to other customers is targeted for
Q4 2009. Customers may access the 65nm iPDK at the TSMC Online customer design
portal http://online.tsmc.com/online/ or contact their local sales and support
representatives for details.

TSMC’s Open Innovation Platform(TM)

TSMC’s Open Innovation Platform(TM) promotes timeliness-driven innovation
amongst the semiconductor design community, its ecosystem partners and
TSMC’s IP, design implementation and DFM capabilities, process technology
and backend services. The Open Innovation Platform includes a set of ecosystem
interfaces and collaborative components initiated and supported by TSMC that
efficiently empower innovation throughout the supply chain and enables the
sharing of newly-created revenue and profitability. TSMC’s Active Accuracy
Assurance initiative is critical to the Open Innovation Platform, providing the
accuracy and quality required in ecosystem interfaces and collaborative

About TSMC

is the world’s largest dedicated semiconductor foundry, providing the
industry’s leading process technology and the foundry’s largest
portfolio of process-proven libraries, IP, design tools and reference flows. The
Company’s total managed capacity in 2008 exceeded 9 million (8-inch
equivalent) wafers, including capacity from two advanced 12-inch - GigaFabs(TM),
four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned
subsidiaries, WaferTech and TSMC (China), and its joint venture fab, SSMC. TSMC
is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC please
visit http://www.tsmc.com.


Wendy Matthews, TSMC North America Corporate, +1-408-382-8030, or Michael
Kramer, Public Relations, +886-3-5636688, ext. 7126216, both of TSMC