SCOTTSDALE, Arizona, March 18 /PRNewswire/ --
- CMD Paper on New Re-Passivation Technology to be Presented as Part of WLCSP Forum Program Track
California Micro Devices announced it would deliver a technical paper on a new CSP repassivation technology designed to minimize parasitic elements in ASIP(TM) (Application Specific Integrated Passive(TM)) products at the IMAPS 4th Annual International Conference and Exhibition on Device Packaging, March 17th through March 20th, 2008, at the Radisson Fort McDowell Resort and Casino in Scottsdale, Arizona. The presentation will be part of a technical track of papers sponsored by the Wafer Level Chip Scale (WLCSP) Forum on wafer level chip scale package board reliability.
New CSP Manufacturing Technology Improves ASIP Performance and Reliability
The paper, entitled "A Novel Re-Passivation/RDL CSP Technology for Minimizing Parasitic Elements in ASIP Products," addresses the role of parasitic capacitances in WLCSP technologies and presents an optimized re-passivation and RDL technology for WLCSP that can lead to improved electrical performance in CSP based electrostatic discharge (ESD) protection products and electromagnetic interference (EMI) filters and enhanced thermo-mechanical reliability. The paper will be presented by Dr. Umesh Sharma, director of Foundry Engineering and Operations at California Micro Devices. The paper will be available for downloading from the corporate website after the conference by going to: http://www.cmd.com/applications/papers.php, or from the Wafer Level Chipscale Forum website at: http://www.wlcspforum.org.
Panel Discussion on WLCSP Reliability
During the IMAPS device packaging conference, the WLCSP Forum will host two panel discussions on WLCSP board reliability. The first session, taking place on March 18th, will feature a presentation on California Micro Devices' new re-passivation and RDL CSP technology and four other technical papers written and presented by WLCSP Forum members. The panel discussion will be co-hosted by Kyle Baker, California Micro Devices' vice president of marketing and the Chairman of the WLCSP Forum.
About California Micro Devices Corporation
California Micro Devices Corporation is a leading supplier of application specific analog and mixed signal semiconductor products for the mobile handset, digital consumer electronics and personal computer markets. Key products include protection devices for mobile handsets, digital consumer electronics products such as digital TVs, and personal computers as well as analog and mixed signal ICs for mobile handset displays. Detailed corporate and product information may be accessed at http://www.cmd.com.
ASIP and Application Specific Integrated Passive are trademarks of California Micro Devices Corporation. All trademarks are property of their respective owners.
Web site: http://www.cmd.com
Richard Haas of California Micro Devices, +1-408-934-3108, richardh@cmd.com
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